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1. general description the 74aup2g126 provides the dual non-inve rting buffer/line driver with 3-state output. the 3-state output is controlled by the output enable input (noe). a low level at pin noe causes the output to assume a high-im pedance off-state. this device has the input-disable feature, which allows floating input signals. the inputs are disabled when the output enable input noe is low. schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 0.8 v to 3.6 v. this device ensures a very low static and dynamic power consumption across the entire v cc range from 0.8 v to 3.6 v. this device is fully specified for pa rtial power-down ap plications using i off . the i off circuitry disables the output, preventing a damaging backflow current through the device when it is powered down. 2. features and benefits ? wide supply voltage range from 0.8 v to 3.6 v ? high noise immunity ? complies with jedec standards: ? jesd8-12 (0.8 v to 1.3 v) ? jesd8-11 (0.9 v to 1.65 v) ? jesd8-7 (1.2 v to 1.95 v) ? jesd8-5 (1.8 v to 2.7 v) ? jesd8-b (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f class 3a exceeds 5000 v ? mm jesd22-a115-a exceeds 200 v ? cdm jesd22-c101e exceeds 1000 v ? low static power consumption; i cc = 0.9 ? a (maximum) ? latch-up performance exceeds 100 ma per jesd78 class ii ? inputs accept voltages up to 3.6 v ? low noise overshoot and undershoot < 10 % of v cc ? input-disable feature allows floating input conditions ? i off circuitry provides partial power-down mode operation ? multiple package options ? specified from ? 40 ? cto+85 ? c and ? 40 ? cto+125 ? c 74aup2g126 low-power dual buffer/line driver; 3-state rev. 9 ? 11 february 2013 product data sheet
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 2 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. functional diagram table 1. ordering information type number package temperature range name description version 74aup2g126dc ? 40 ? c to +125 ? c vssop8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 74AUP2G126GT ? 40 ? c to +125 ? c xson8 plastic extremely thin sm all outline package; no leads; 8 terminals; body 1 ? 1.95 ? 0.5 mm sot833-1 74aup2g126gf ? 40 ? c to +125 ? c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.35 ? 1 ? 0.5 mm sot1089 74aup2g126gd ? 40 ? cto+125 ? c xson8 plastic extremely thin sm all outline package; no leads; 8 terminals; body 3 ? 2 ? 0.5 mm sot996-2 74aup2g126gm ? 40 ? c to +125 ? c xqfn8 plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 ? 1.6 ? 0.5 mm sot902-2 74aup2g126gn ? 40 ? c to +125 ? c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.2 ? 1.0 ? 0.35 mm sot1116 74aup2g126gs ? 40 ? c to +125 ? c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.35 ? 1.0 ? 0.35 mm sot1203 table 2. marking codes type number marking code [1] 74aup2g126dc p26 74AUP2G126GT p26 74aup2g126gf pn 74aup2g126gd p26 74aup2g126gm p26 74aup2g126gn pn 74aup2g126gs pn fig 1. logic symbol fig 2. logic diagram (one gate) 001aah787 2a 1a 2oe 1oe 1y 2y mna234 noe na ny
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 3 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 6. pinning information 6.1 pinning 6.2 pin description fig 3. pin configuration sot765-1 fig 4. pin configuration sot833-1, sot1089, sot1116 and sot1203 74aup2g126 1oe v cc 1a 2oe 2y 1y gnd 2a 001aae997 1 2 3 4 6 5 8 7 74aup2g126 1y 2oe v cc 2a 2y 1a 1oe gnd 001aae998 36 27 18 45 transparent top view fig 5. pin configuration sot996-2 f ig 6. pin configuration sot902-2 001aaj474 74aup2g126 transparent top view 8 7 6 5 1 2 3 4 1oe 1a 2y gnd v cc 2oe 1y 2a 001aae999 1a 1y 1oe v cc 2y 2oe gnd 2a transparent top view 3 6 4 1 5 8 7 2 terminal 1 index area 74aup2g126 table 3. pin description symbol pin description sot765-1, sot833-1, sot1089, sot996-2, sot1116 and sot1203 sot902-2 1oe, 2oe 1, 7 7, 1 output enable input (active high) 1a, 2a 2, 5 6, 3 data input 1y, 2y 6, 3 2, 5 data output gnd 4 4 ground (0 v) v cc 8 8 supply voltage
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 4 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. 8. limiting values [1] the minimum input and output voltage ratings may be exceed ed if the input and output current ratings are observed. [2] for vssop8 packages: above 110 ? c the value of p tot derates linearly with 8.0 mw/k. for xson8 and xqfn8 packages: above 118 ? c the value of p tot derates linearly with 7.8 mw/k. 9. recommended operating conditions table 4. function table [1] input output noe na ny hl l hhh lxz table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v i ik input clamping current v i <0v ? 50 - ma v i input voltage [1] ? 0.5 +4.6 v i ok output clamping current v o <0v ? 50 - ma v o output voltage active mode and power-down mode [1] ? 0.5 +4.6 v i o output current v o =0 vtov cc - ? 20 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +125 ?c [2] -2 5 0m w table 6. operating conditions symbol parameter conditions min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage active mode 0 v cc v power-down mode; v cc =0v 0 3.6 v t amb ambient temperature ? 40 +125 ?c ? t/ ? v input transition rise and fall rate v cc = 0.8 v to 3.6 v 0 200 ns/v
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 5 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 10. static characteristics table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = 25 ?c v ih high-level input voltage v cc = 0.8 v 0.70 ? v cc -- v v cc = 0.9 v to 1.95 v 0.65 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 ? v cc v v cc = 0.9 v to 1.95 v - - 0.35 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.75 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.11 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.32 - - v i o = ? 2.3 ma; v cc = 2.3 v 2.05 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.9 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.72 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.6 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.31 v i o = 1.9 ma; v cc = 1.65 v - - 0.31 v i o = 2.3 ma; v cc = 2.3 v - - 0.31 v i o = 3.1 ma; v cc = 2.3 v - - 0.44 v i o = 2.7 ma; v cc = 3.0 v - - 0.31 v i o = 4.0 ma; v cc = 3.0 v - - 0.44 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.1 ? a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- ? 0.1 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.2 ? a ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.2 ? a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --0 . 5 ? a
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 6 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state ? i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --4 0 ? a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] --1 1 0 ? a all inputs; v i = gnd to 3.6 v; noe = gnd; v cc = 0.8 v to 3.6 v [2] --1 ? a c i input capacitance v i = gnd or v cc ; v cc = 0 v to 3.6 v - 0.9 - pf c o output capacitance output enabled; v o = gnd; v cc = 0 v - 1.7 - pf output disabled; v o = gnd or v cc ; v cc = 0 v to 3.6 v -1.5-pf t amb = ? 40 ?c to +85 ?c v ih high-level input voltage v cc = 0.8 v 0.70 ? v cc -- v v cc = 0.9 v to 1.95 v 0.65 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 ? v cc v v cc = 0.9 v to 1.95 v - - 0.35 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.7 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.03 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.30 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.97 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.85 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.67 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.55 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.37 v i o = 1.9 ma; v cc = 1.65 v - - 0.35 v i o = 2.3 ma; v cc = 2.3 v - - 0.33 v i o = 3.1 ma; v cc = 2.3 v - - 0.45 v i o = 2.7 ma; v cc = 3.0 v - - 0.33 v i o = 4.0 ma; v cc = 3.0 v - - 0.45 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.5 ? a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- ? 0.5 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.5 ? a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 7 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.6 ? a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --0.9 ? a ? i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --5 0 ? a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] - - 120 ? a all inputs; v i = gnd to 3.6 v; noe = gnd; v cc = 0.8 v to 3.6 v [2] --1 ? a t amb = ? 40 ? c to +125 ?c v ih high-level input voltage v cc = 0.8 v 0.75 ? v cc -- v v cc = 0.9 v to 1.95 v 0.70 ? v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.25 ? v cc v v cc = 0.9 v to 1.95 v - - 0.30 ? v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 ? a; v cc = 0.8 v to 3.6 v v cc ? 0.11 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.6 ? v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 0.93 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.17 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.77 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.67 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.40 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.30 - - v v ol low-level output voltage v i = v ih or v il i o = 20 ? a; v cc = 0.8 v to 3.6 v - - 0.11 v i o = 1.1 ma; v cc = 1.1 v - - 0.33 ? v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.41 v i o = 1.9 ma; v cc = 1.65 v - - 0.39 v i o = 2.3 ma; v cc = 2.3 v - - 0.36 v i o = 3.1 ma; v cc = 2.3 v - - 0.50 v i o = 2.7 ma; v cc = 3.0 v - - 0.36 v i o = 4.0 ma; v cc = 3.0 v - - 0.50 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - ? 0.75 ? a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- ? 0.75 ? a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - ? 0.75 ? a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 8 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state [1] one input at v cc ? 0.6 v, other input at v cc or gnd. [2] to show i cc remains very low when the input-disable feature is enabled. 11. dynamic characteristics ? i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- ? 0.75 ? a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --1.4 ? a ? i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --7 5 ? a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] - - 180 ? a all inputs; v i = gnd to 3.6 v; noe = gnd; v cc = 0.8 v to 3.6 v [2] --1 ? a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit table 8. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 9 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max (85 ?c) max (125 ?c) c l = 5 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 20.6 - - - - ns v cc = 1.1 v to 1.3 v 2.8 5.5 10.5 2.5 11.7 12.9 ns v cc = 1.4 v to 1.6 v 2.2 3.9 6.1 2.0 7.3 8.1 ns v cc = 1.65 v to 1.95 v 1.9 3.2 4.1 1.7 6.1 6.7 ns v cc = 2.3 v to 2.7 v 1.6 2.6 3.6 1.4 4.3 4.9 ns v cc = 3.0 v to 3.6 v 1.4 2.4 3.1 1.2 3.9 4.4 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 71.6 - - - - ns v cc = 1.1 v to 1.3 v 2.8 6.2 12.4 2.6 13.6 13.6 ns v cc = 1.4 v to 1.6 v 2.3 4.2 6.9 2.2 7.4 7.7 ns v cc = 1.65 v to 1.95 v 1.9 3.3 5.3 1.7 5.9 6.2 ns v cc = 2.3 v to 2.7 v 1.5 2.4 3.6 1.4 3.8 4.1 ns v cc = 3.0 v to 3.6 v 1.3 2.0 2.9 1.2 3.2 3.4 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 10.3 - - - - ns v cc = 1.1 v to 1.3 v 2.6 4.2 6.2 2.9 6.4 6.5 ns v cc = 1.4 v to 1.6 v 2.1 3.2 4.4 2.2 4.6 4.7 ns v cc = 1.65 v to 1.95 v 2.1 3.1 4.4 1.7 4.6 4.8 ns v cc = 2.3 v to 2.7 v 1.7 2.4 3.2 1.4 3.4 3.6 ns v cc = 3.0 v to 3.6 v 2.1 2.8 3.6 1.2 3.7 3.8 ns
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 9 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state c l = 10 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 24.0 - - - - ns v cc = 1.1 v to 1.3 v 3.2 6.4 12.3 3.0 13.8 15.2 ns v cc = 1.4 v to 1.6 v 2.1 4.5 7.3 1.9 8.5 9.4 ns v cc = 1.65 v to 1.95 v 1.9 3.8 5.5 1.7 6.8 7.6 ns v cc = 2.3 v to 2.7 v 2.1 3.2 4.2 1.6 5.3 5.9 ns v cc = 3.0 v to 3.6 v 1.8 3.0 3.8 1.6 4.6 5.2 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 75.3 - - - - ns v cc = 1.1 v to 1.3 v 3.2 7.1 14.1 3.0 15.4 15.4 ns v cc = 1.4 v to 1.6 v 2.2 4.8 8.0 2.1 8.3 8.6 ns v cc = 1.65 v to 1.95 v 1.8 3.9 5.9 1.7 6.5 6.8 ns v cc = 2.3 v to 2.7 v 1.5 2.9 4.2 1.4 4.5 4.8 ns v cc = 3.0 v to 3.6 v 1.4 2.6 3.6 1.3 3.8 4.0 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 12.2 - - - - ns v cc = 1.1 v to 1.3 v 3.5 5.3 7.6 3.3 7.9 7.9 ns v cc = 1.4 v to 1.6 v 2.2 4.1 5.6 2.1 5.7 5.9 ns v cc = 1.65 v to 1.95 v 2.4 4.2 5.7 1.7 5.8 6.0 ns v cc = 2.3 v to 2.7 v 1.9 3.2 4.1 1.4 4.3 4.5 ns v cc = 3.0 v to 3.6 v 2.4 4.1 5.0 1.3 5.2 5.3 ns c l = 15 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 27.4 - - - - ns v cc = 1.1 v to 1.3 v 3.6 7.2 14.1 3.3 15.8 17.5 ns v cc = 1.4 v to 1.6 v 3.0 5.1 8.1 2.5 9.8 10.9 ns v cc = 1.65 v to 1.95 v 2.2 4.3 6.3 2.0 7.9 8.8 ns v cc = 2.3 v to 2.7 v 2.0 3.7 4.9 1.8 6.0 6.7 ns v cc = 3.0 v to 3.6 v 2.0 3.5 4.4 1.8 5.4 6.1 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 79.2 - - - - ns v cc = 1.1 v to 1.3 v 3.6 7.8 15.8 3.3 17.1 17.1 ns v cc = 1.4 v to 1.6 v 3.0 5.4 8.8 2.9 9.4 9.7 ns v cc = 1.65 v to 1.95 v 2.1 4.3 6.7 2.0 7.3 7.7 ns v cc = 2.3 v to 2.7 v 1.8 3.4 4.8 1.7 5.2 5.6 ns v cc = 3.0 v to 3.6 v 1.6 3.1 4.1 1.5 4.5 4.7 ns table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 9 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max (85 ?c) max (125 ?c)
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 10 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 14.9 - - - - ns v cc = 1.1 v to 1.3 v 4.3 6.4 8.5 3.7 9.3 9.4 ns v cc = 1.4 v to 1.6 v 3.0 5.0 6.6 2.5 6.9 7.0 ns v cc = 1.65 v to 1.95 v 3.1 5.4 6.6 2.0 7.4 7.5 ns v cc = 2.3 v to 2.7 v 2.4 4.0 5.0 1.7 5.1 5.5 ns v cc = 3.0 v to 3.6 v 3.2 5.3 6.2 1.5 6.7 6.9 ns c l = 30 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 37.4 - - - - ns v cc = 1.1 v to 1.3 v 4.8 9.5 18.7 4.4 21.4 24.0 ns v cc = 1.4 v to 1.6 v 4.0 6.7 10.8 3.0 13.0 14.5 ns v cc = 1.65 v to 1.95 v 2.9 5.6 8.4 2.6 10.3 11.5 ns v cc = 2.3 v to 2.7 v 2.7 4.8 6.3 2.5 7.8 8.7 ns v cc = 3.0 v to 3.6 v 2.7 4.6 5.8 2.5 7.0 8.3 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 90.6 - - - - ns v cc = 1.1 v to 1.3 v 4.7 10.0 20.4 4.3 22.0 22.0 ns v cc = 1.4 v to 1.6 v 3.0 6.9 11.3 3.7 12.0 12.5 ns v cc = 1.65 v to 1.95 v 2.6 5.6 8.6 3.2 9.5 10.1 ns v cc = 2.3 v to 2.7 v 2.3 4.5 6.3 2.9 6.8 7.3 ns v cc = 3.0 v to 3.6 v 2.2 4.2 5.8 2.7 6.4 6.7 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 51.6 - - - - ns v cc = 1.1 v to 1.3 v 6.0 9.8 13.6 4.7 14.3 14.4 ns v cc = 1.4 v to 1.6 v 4.5 7.7 10.5 3.0 10.7 11.0 ns v cc = 1.65 v to 1.95 v 5.2 8.8 11.4 2.6 11.5 11.6 ns v cc = 2.3 v to 2.7 v 3.9 6.4 7.4 2.3 9.0 10.2 ns v cc = 3.0 v to 3.6 v 5.5 9.0 10.7 2.2 10.8 12.0 ns table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 9 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max (85 ?c) max (125 ?c)
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 11 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzh and t pzl . [4] t dis is the same as t phz and t plz . [5] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of the outputs. 12. waveforms c l = 5 pf, 10 pf, 15 pf and 30 pf c pd power dissipation capacitance output enabled; f i = 1 mhz; v i =gndtov cc [5] v cc = 0.8 v - 2.7 - - - - pf v cc = 1.1 v to 1.3 v - 2.8 - - - - pf v cc = 1.4 v to 1.6 v - 2.9 - - - - pf v cc = 1.65 v to 1.95 v - 3.0 - - - - pf v cc = 2.3 v to 2.7 v - 3.6 - - - - pf v cc = 3.0 v to 3.6 v - 4.2 - - - - pf table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 9 . symbol parameter conditions 25 ?c ? 40 ? c to +125 ?c unit min typ [1] max min max (85 ?c) max (125 ?c) measurement points are given in table 9 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 7. the data input (na) to output (ny) propagation delays mna230 t phl t plh v m v m na input ny output gnd v i v oh v ol table 9. measurement points supply voltage output input v cc v m v m v i t r = t f 0.8 v to 3.6 v 0.5 ? v cc 0.5 ? v cc v cc ? 3.0 ns
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 12 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state measurement points are given in table 10 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 8. enable and disable times mna949 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m table 10. measurement points supply voltage input output v cc v m v m v x v y 0.8 v to 1.6 v 0.5 ? v cc 0.5 ? v cc v ol ? 0.1 v v oh ? 0.1 v 1.65 v to 2.7 v 0.5 ? v cc 0.5 ? v cc v ol ? 0.15 v v oh ? 0.15 v 3.0 v to 3.6 v 0.5 ? v cc 0.5 ? v cc v ol ? 0.3 v v oh ? 0.3 v
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 13 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state [1] for measuring enable and disable times r l = 5 k ? . for measuring propagation delays, se t-up and hold times and pulse width r l = 1 m? . test data is given in table 11 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 9. test circuit for measuring switching times 001aac521 dut r t v i v o v ext v cc r l 5 k c l g table 11. test data supply voltage load v ext v cc c l r l [1] t plh , t phl t pzh , t phz t pzl , t plz 0.8 v to 3.6 v 5 pf, 10 pf, 15 pf and 30 pf 5 k ? or 1 m ? open gnd 2 ? v cc
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 14 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 13. package outline fig 10. package outline sot765-1 (vssop8) unit a 1 a max. a 2 a 3 b p lh e l p wy v ce d (1) e (2) z (1) references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 0 0.13 0.1 0.2 0.4 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 q 0.21 0.19 sot765-1 mo-187 02-06-07 w m b p d z e 0.12 14 8 5 a 2 a 1 q l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale vssop8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 1 pin 1 index
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 15 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 11. package outline sot833-1 (xson8) terminal 1 index area references outline version european projection issue date iec jedec jeita sot833-1 - - - mo-252 - - - sot833-1 07-11-14 07-12-07 dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 2.0 1.9 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.50.6 a (1) max 0.5 0.04 1 8 2 7 3 6 4 5 8 (2) 4 (2) a
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 16 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 12. package outline sot1089 (xson8) references outline version european projection issue date iec jedec jeita sot1089 mo-252 sot1089_po 10-04-09 10-04-12 unit mm max nom min 0.5 0.04 1.40 1.35 1.30 1.05 1.00 0.95 0.55 0.35 0.35 0.30 0.27 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm sot1089 a 1 bl 1 0.40 0.35 0.32 0.20 0.15 0.12 deee 1 l 0 0.5 1 mm scale terminal 1 index area e d detail x a a 1 l l 1 b e 1 e terminal 1 index area 1 4 8 5 (4) (2) (8) (2) x
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 17 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 13. package outline sot996-2 (xson8) references outline version european projection issue date iec jedec jeita sot996-2 sot996-2_po 07-12-21 12-11-20 unit (1) mm max nom min 0.5 0.05 0.00 2.1 1.9 3.1 2.9 0.5 0.3 0.15 0.05 0.6 0.4 0.5 1.5 0.05 a dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm sot996-2 a 1 b 0.35 0.15 deee 1 ll 1 l 2 v 0.1 wy 0.05 y 1 0.1 0 1 2 mm scale c y c y 1 x terminal 1 index area b a d e detail x a a 1 b 14 85 e 1 e ac b v c w l 2 l 1 l
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 18 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 14. package outline sot902-2 (xqfn8) references outline version european projection issue date iec jedec jeita sot902-2 - - - mo-255 - - - sot902-2_po 10-11-02 11-03-31 unit (1) mm max nom min 0.5 0.05 0.00 1.65 1.60 1.55 1.65 1.60 1.55 0.55 0.5 0.15 0.10 0.05 0.1 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. xqfn8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm sot902-2 a 1 b 0.25 0.20 0.15 deee 1 l 0.35 0.30 0.25 l 1 vw 0.05 yy 1 0.05 0 1 2 mm scale terminal 1 index area b a d e x c y c y 1 terminal 1 index area 3 l l 1 b e 1 e ac b v c w 2 1 5 6 7 metal area not for soldering 8 4 a 1 a detail x
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 19 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 15. package outline sot1116 (xson8) references outline version european projection issue date iec jedec jeita sot1116 sot1116_po 10-04-02 10-04-07 unit mm max nom min 0.35 0.04 1.25 1.20 1.15 1.05 1.00 0.95 0.55 0.3 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm sot1116 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area e d (4) (2) (8) (2) a 1 a e 1 e 1 e 1 e l l 1 b 4321 5 6 7 8
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 20 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state fig 16. package outline sot1203 (xson8) references outline version european projection issue date iec jedec jeita sot1203 sot1203_po 10-04-02 10-04-06 unit mm max nom min 0.35 0.04 1.40 1.35 1.30 1.05 1.00 0.95 0.55 0.35 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. xson8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm sot1203 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area e d (4) (2) (8) (2) a a 1 e l l 1 b e 1 e 1 e 1 1 8 2 7 3 6 4 5
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 21 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 14. abbreviations 15. revision history table 12. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 13. revision history document id release date data sheet status change notice supersedes 74aup2g126 v.9 20130211 product data sheet - 74aup2g126 v.8 modifications: ? for type number 74aup2g126gd xson8u has changed to xson8. 74aup2g126 v.8 20120606 product data sheet - 74aup2g126 v.7 74aup2g126 v.7 20111201 product data sheet - 74aup2g126 v.6 74aup2g126 v.6 20100621 product data sheet - 74aup2g126 v.5 74aup2g126 v.5 20090202 product data sheet - 74aup2g126 v.4 74aup2g126 v.4 20090114 product data sheet - 74aup2g126 v.3 74aup2g126 v.3 20080409 product data sheet - 74aup2g126 v.2 74aup2g126 v.2 20070515 product data sheet - 74aup2g126 v.1 74aup2g126 v.1 20061009 product data sheet - -
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 22 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? 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nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
74aup2g126 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 9 ? 11 february 2013 23 of 24 nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 74aup2g126 low-power dual buffer/line driver; 3-state ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 11 february 2013 document identifier: 74aup2g126 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 4 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 22 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 contact information. . . . . . . . . . . . . . . . . . . . . 23 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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